Retail Bond Issuance Programme
 
 
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The HKMC established its HK$20 Billion Retail Bond Issuance Programme in May 2004, following the successful application of the placing bank mechanism since 2001 under which retail bonds were distributed through designated placing banks. These placing backs also perform the role of market makers for the bonds, facilitating transactions in the secondary market.
Major features of the programme are as follows:

 
 
Issuer: The Hong Kong Mortgage Corporation Limited
Programme Amount: HK$20 billion
Distribution: Distribution through Placing Banks
Application channel: In person to designated branches of the Placing Banks
Currencies: Hong Kong dollars or other currencies
Ranking of the notes: Direct, unsecured and unsubordinated debt obligations of the HKMC
Maturities: Any maturity
Clearing System:
Central Moneymarkets Unit (CMU)
 
     
 
The HKMC will consider applications for Placing Banks for its Retail Bond Issuance Programme. Interested banks or financial institutions are welcome to submit their applications to the Treasury Department of the HKMC for consideration.
 
 

 

 
 
     
   
     
 
 
 
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