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Retail Bond Issuance Programme

To support the development of the retail bond market, the Corporation established the HK$20 Billion Retail Bond Issuance Programme. Under this programme, placing banks use their retail branch networks, telephone and electronic banking facilities to place debt securities issued by the Corporation with retail investors.  These placing backs also perform the role of market makers for the bonds, facilitating transactions in the secondary market.

 

Major features of the programme are as follows:

 

Issuer

The Hong Kong Mortgage Corporation Limited

Programme Amount

HK$20 billion

Distribution

Distribution through Placing Banks

Application channel

In person to designated branches of the Placing Banks

Currencies

Hong Kong dollars or other currencies

Ranking of the notes

Direct, unsecured and unsubordinated debt obligations of the HKMC

Maturities

Any maturity

Clearing System

Central Moneymarkets Unit (CMU)

 

 

The HKMC will consider applications for Placing Banks for its Retail Bond Issuance Programme. Interested banks or financial institutions are welcome to submit their applications to the Treasury Department of the HKMC for consideration.